Process for creating titled microlens

ABSTRACT

A microlens structure that includes a wedge formed to support and tilt the microlens is disclosed. The wedge results from heating a layer of patterned flowable material. The degree and direction of incline given to the wedge can be controlled in part by the type of patterning that is performed.

FIELD OF THE INVENTION

The invention relates to the fabrication of microlens structures forimage capture or display systems, and more specifically to structuresand methods of fabrication of microlens arrays for solid state imagersystems.

BACKGROUND OF THE INVENTION

Solid state imagers, including charge coupled devices (CCD) and CMOSsensors, are commonly used in photo-imaging applications. A solid stateimager includes a focal plane array of pixels. Each of the pixelsincludes a photovoltaic device for converting light energy to electricalsignals. The photovoltaic device can be a photogate, photoconductor, ora photodiode having a doped region for accumulating photo-generatedcharge.

Microlenses are commonly placed in a corresponding array over the imagerpixel(s). A microlens is used to focus light onto the initial chargeaccumulation region, for example. Conventional technology formsmicrolenses from photoresist material which is patterned into squares orcircles provided respectively over the pixels. The patterned photoresistmaterial is then heated during manufacturing to shape and cure themicrolens.

Use of microlenses significantly improves the photosensitivity andefficiency of the imaging device by collecting light from a large lightcollecting area and focusing it on a small photosensitive area of thepixel. The ratio of the overall light collecting area to thephotosensitive area of the pixel is known as the “fill factor.”

The use of microlens arrays is of increasing importance in imagerapplications. Imager applications are requiring imager arrays of smallersize and greater resolution. As pixel size decreases and pixel densityincreases, problems such as crosstalk between pixels become morepronounced. Also, pixels of reduced size have a smaller chargeaccumulation area. Reduced sizes of pixels result in smaller accumulatedcharges which are read out and processed by signal processing circuits.

As the size of imager arrays and photosensitive regions of pixelsdecreases, it becomes increasingly difficult to provide a microlenscapable of focusing incident light rays onto the photosensitive regions.This problem is due in part to the increased difficulty in constructinga small enough microlens that has the optimal focal characteristics forthe imager device process and that optimally adjusts for opticalaberrations introduced as the light passes through the various devicelayers. Also, it is difficult to correct possible distortions created bymultiple regions above the photosensitive area, which results inincreased crosstalk between adjacent pixels. Crosstalk can result whenoff-axis light strikes a microlens at an obtuse angle. The off-axislight passes through planarization regions and a color filter, missesthe intended photosensitive region and instead strikes an adjacentphotosensitive region.

Microlens shaping and fabrication through heating and melting microlensmaterials also becomes increasingly difficult as microlens structuresdecrease in size. Previous approaches to control microlens shaping andfabrication do not provide sufficient control to ensure opticalproperties such as focal characteristics, radius of the microlens orother parameters needed to provide a desired focal effect for smallermicrolens designs. Consequently, imagers with smaller sized microlenseshave difficulty in achieving high color fidelity and signal-to-noiseratios.

BRIEF SUMMARY OF THE INVENTION

The various exemplary embodiments of the invention provide a variety ofstructures and methods used to adjust the shape, radius and/or height ofa microlens for a pixel array. The embodiments use structures thataffect volume and surface force parameters during microlens formation.Exemplary embodiments are directed to a microlens structure thatincludes a wedge formed to support and tilt the microlens to achievedesired focusing properties. The wedge results from heating a layer offlowable material. The flowable material is patterned such that a wedgeis formed during reflow of the material. The degree and direction ofincline given to the wedge can be controlled by the type of patterningthat is done in the flowable material.

In one exemplary embodiment, a series of parallel strips, where eachstrip is successively smaller, is used as the wedge. When the patternedflowable material is reflowed, the larger strips at one end will becomethe thicker portion of the wedge. The smaller strips at the other endwill become the narrower portion of the wedge. Each microlens can bepatterned identically. Alternatively, pairs and other groupings can bepatterned to form unlimited wedge arrangements.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other advantages and features of the invention willbecome more apparent from the detailed description of the exemplaryembodiments provided below with reference to the accompanying drawings,in which:

FIG. 1 illustrates in plan view a reticle used to pattern photoresistmaterial according to an exemplary embodiment of the invention;

FIG. 2 illustrates a cross-sectional view of photoresist material formedon a substrate having the reticle of FIG. 1 patterned over it;

FIG. 3 is a cross-sectional view of the photoresist strips of FIG. 2after developing according to an exemplary embodiment of the invention;

FIG. 4 is a cross-sectional view of a solid resist wedge formed afterreflow according to an exemplary embodiment of the invention;

FIG. 5 is a cross-sectional view of a microlens supported by the wedgeaccording to an exemplary embodiment of the invention;

FIG. 6 is a plan view of a pair of adjacent microlens support areas withresist strips developed to form a complementary pattern according to anexemplary embodiment of the invention;

FIG. 7 a is a cross-sectional view of a pair of adjacent microlensessupported by a pair of adjacent microlens support areas according to anembodiment of FIG. 6;

FIG. 7 b is a cross-sectional view of a pair of adjacent microlensessupported by a pair of adjacent microlens support areas sharing a pixelaccording to another embodiment of FIG. 6;

FIG. 8 is a plan view of four adjacent microlens support areas withresist strips developed to form a complementary pattern according to anexemplary embodiment of the invention;

FIG. 9 is a schematic of an imaging device using a pixel having amicrolens constructed in accordance with an embodiment of the invention;and

FIG. 10 illustrates a schematic of a processing system including theimaging device of FIG. 9.

DETAILED DESCRIPTION OF THE INVENTION

In the following detailed description, reference is made to theaccompanying drawings, which form a part hereof and show by way ofillustration specific embodiments in which the invention may bepracticed. These embodiments are described in sufficient detail toenable those skilled in the art to practice the invention, and it is tobe understood that other embodiments may be utilized, and thatstructural, logical, and electrical changes may be made withoutdeparting from the spirit and scope of the present invention. Theprogression of processing steps described is exemplary of embodiments ofthe invention; however, the sequence of steps is not limited to that setforth herein and may be changed as is known in the art, with theexception of steps necessarily occurring in a certain order.

The term “pixel,” as used herein, refers to a photo-element unit cellcontaining a photosensor device and associated structures for convertingphotons to an electrical signal. The term “flow,” “flowing” or“reflowing” refers to a change in shape of a material which is heatedand melts, thereby producing a material flow or shape alteration in thematerial caused by heating or other similar process. “Flow” is aninitial melting and “reflow” is a subsequent melting of material thathas been previously flowed.

In addition, while the invention is described with reference to asemiconductor-based imager, such as a CMOS imager, it should beappreciated that the invention may be applied in any micro-electronic ormicro-optical device that requires high quality microlenses foroptimized performance. Additional exemplary micro-optical devices whichcan employ the invention include other solid state imaging devices,e.g., CCD and others, and display devices where a pixel emits light.

Referring now the drawings, where like elements are designated by likereference numerals, FIG. 1 illustrates a reticle 10 used to pattern aflowable material, for example, a photoresist material according to anexemplary embodiment of the invention. The reticle may be formed of achrome material, for example. Stripes 11 on the recticle vary in size.In the exemplification shown, the reticle stripes 11 are showndecreasing in size from left to the right, such that the stripe widthsare decreasing in a direction perpendicular to the longitudinal axis ofthe stripes. The reticle has openings 12 of about 0.3 microns to about0.5 microns wide between the stripes 11. The reticle 10 is placed over asubstrate 5 having a layer of photoresist material 20 over aphotosensitive region 6 of a pixel, as illustrated in FIG. 2. Thephotoresist material is a photo-sensitive transparent material 20. Forexample, it could be the same material that is used for the formation ofthe microlens. In another embodiment, the material may be selected tocontrol the phase of polarization.

Referring to FIG. 3, after development of the photoresist material 20, aformation of photoresist strips 31, 32, 33, 34, 35, 36, 37 remain on thesubstrate 5. The photoresist strips 31, 32, . . . 37 have widths W₁, W₂,. . . W₇ on the order of a few tenths of a micron. The widths W₁, W₂, .. . W₇ decrease in a direction perpendicular to the longitudinal axis ofthe strips.

Referring to FIG. 4, the photoresist strips 31, 32, . . . 37 aresubjected to reflow conditions to produce a wedge 15. Comparing FIG. 3and FIG. 4, it can be seen that photoresist strips 31-37 have flowedtogether to generate the wedge 15. The wedge 15 is thicker on the leftside, where photoresist strips 31, 32, 33 were wider. The wedge 15 isthinner on the right side, where photoresist strips 35, 36, 37 werenarrower. In other words, the wedge 15 has a first thickness D₁ on theside having the thickest photoresist strip 31 and a second thickness D₂on the side having the thinnest photoresist strip 37, wherein D₁ isgreater than D₂. Thus, the wedge 15 has a sloped upper surface having anangle, “α,” described by the tangent of the bumps of the upper surface14 of the wedge 15 and the horizontal surface 4 of the substrate 5.Angle α can be tailored to be any angle desired, but in an exemplaryembodiment is typically less than about 10 degrees.

As illustrated in FIG. 4, the wedge 15 may not have a completely smoothupper surface 14. The wedge may be smoothed out to have a flat surfaceby a smoothing process such as lithography. The degree to which thewedge is smoothed may depend on the chosen degree of resolution of thelithography tool and the flow properties of the flowable wedge material.The following discussion describes a wedge without a smooth surface forexemplary purposes only; however it should be noted that the wedge mayhave a smooth surface as well.

Referring to FIG. 5, the wedge 15 provides a support surface for atilted microlens 25, which is formed on and supported by the wedge 15.Due to the slope of the wedge 15, the microlens 25 is tilted such thatits orientation allows its focal spot to shift to a target location,such as a photosensitive element 6. This allows placement of a microlensoff-center from the photosensitive element 6. The microlens may bedirectly over, but not centered over the photosensitive element, or itmay be adjacent to the photosensitive element; however the tilt angle ofthe wedge allows the microlens to direct incident light to thephotosensitive element. In an array of microlenses formed according tothis embodiment, all of the microlenses may have wedges with the sametilt angle such that the wedges are sloped in the same direction.

As described below in more detail, the focal characteristics of themicrolens arrays are controlled by forming pattern structures ofdiffering widths using a photoresist 25 and flowing the patternedstructures to form a wedge to support and tilt the microlenses. Thereticle used to pattern the structure has a series of parallel strips,each of which is successively smaller than the preceding strip, suchthat the structures formed by the smaller strips form the thinner sideof the wedge. Subsequent processing, such as baking and packaging, takesplace according to standard industry practice.

In another embodiment, two tilted microlenses may be provided as part ofa two-way shared pixel layout. By providing two tilted microlenses, itis possible to shift the focal point of each of the two microlenses in adesired manner. In other words, rather than having one microlenscentered over one pixel, there may be more than one microlens over asingle pixel or adjacent to the single pixel, each of which may focusincident light to that pixel. Thus, two microlenses may be formed overonly one photosensitive element. Alternatively, two targeted devices canbe placed closer together, allowing more pixel area elsewhere under themicrolens for logic circuitry. Referring to FIG. 6, two reticles 50, 60are oriented such that the wider reticle stripes 38, 39 are adjacent toeach other.

The resulting wedges have their thicker portions adjacent to each other,such that both wedges 55, 65 would support microlenses that tilt awayfrom their adjacent sides, as shown in FIGS. 7 a and 7 b. Referring toFIG. 7 a, two tilted microlenses 75, 85 are used to shift their focalpoints such that two targeted photosensitive devices 56, 66 may beplaced closer together in the substrate. Referring to FIG. 7 b, twotilted microlenses are used to shift the focal points to a commonphotosensitive element 156. In the example illustrated in FIG. 7 b,wedge 165 has a larger angle β than angle α of wedge 155. Sincemicrolens 185 is not directly over the photosensitive element 156, itmust be tilted more (angle β must be greater than angle α) in order todirect incident light to the photosensitive element 156.

Advantageously, by controlling the degree of tilt relative to aphotosensitive element of the imager, more freedom in the design ofphotosensitive elements is permitted and the focal point of the tiltedmicrolens can be shifted to where the photosensitive element is placedwithin the pixel.

Referring to FIG. 8, another embodiment is shown where four reticles 90,100, 110, 120 are oriented diagonally such that the wider reticlestripes 91, 92, 93, 94 are closer to the center of the four reticles 90,100, 110, 120 than other reticle stripes. In this embodiment, the wedgesformed by reticles 90, 100, 110, 120 will result in four tiltedmicrolenses provided as part of a four-way shared pixel layout. Byproviding four tilted microlenses, it is possible to shift the focalpoint of each of the four microlenses in a desired manner. Thus, thefour microlenses may be formed over a single common photosensitiveelement. The resulting wedges supporting each microlens will havedifferent angles, respectively chosen to direct incident light from itsrespective location to the common photosensitive element. Alternatively,the four microlenses may each be formed over one photosensitive element,but the four targeted devices (e.g., photosensitive devices) can beplaced closer together, allowing more pixel area for logic circuitry ifneeded.

The orientation of the tilted microlens, such as the dimensions, shape,focal length and other focal characteristics are determined by one ormore microlens and imager design parameters including: (1) the distance,width or size of the photosensor under the wedge where the microlensfocuses light; (2) the viscosity of the microlens material used to formthe microlenses during heating; (2) the dimensions and material of thewedge; (4) the alterations in flow behavior of the microlens materialresulting from microlens structures affecting microlens material flowbehavior during heating; (5) the effects of pre-heating or pre-flowtreatment of wedge or microlens materials; (6) the approximateorientation of the microlense structure after heating of the microlensmaterial is completed; and (7) the effects of the wedge material thatmay alter flow properties of the microlens material.

FIG. 9 illustrates an exemplary imaging device 200 that may utilizepixels having tilted microlenses constructed in accordance with theinvention. The imaging device 200 has an imager pixel array 201comprising pixels with microlens constructed as described above. Rowlines are selectively activated by a row driver 202 in response to rowaddress decoder 203. A column driver 204 and column address decoder 205are also included in the imaging device 200. The imaging device 200 isoperated by the timing and control circuit 206, which controls theaddress decoders 203, 205. The control circuit 206 also controls the rowand column driver circuitry 202, 204.

A sample and hold circuit 207 associated with the column driver 204reads a pixel reset signal Vrst and a pixel image signal Vsig forselected pixels. A differential signal (Vrst−Vsig) is produced bydifferential amplifier 208 for each pixel and is digitized byanalog-to-digital converter 209 (ADC). The analog-to-digital converter209 supplies the digitized pixel signals to an image processor 210 whichforms and outputs a digital image.

FIG. 10 shows system 900, a typical processor system modified to includethe imaging device 200 (FIG. 9) of the invention. The processor-basedsystem 900 is exemplary of a system having digital circuits that couldinclude image sensor devices. Without being limiting, such a systemcould include a computer system, still or video camera system, scanner,machine vision, vehicle navigation, video phone, surveillance system,auto focus system, star tracker system, motion detection system, imagestabilization system, and data compression system.

The processor-based system 900, for example a camera system, generallycomprises a central processing unit (CPU) 995, such as a microprocessor,that communicates with an input/output (I/O) device 991 over a bus 993.Imaging device sensor 200 also communicates with the CPU 995 over bus993. The processor-based system 900 also includes random access memory(RAM) 992, and can include removable memory 994, such as flash memory,which also communicate with CPU 995 over the bus 993. Image sensor 800may be combined with a processor, such as a CPU, digital signalprocessor, or microprocessor, with or without memory storage on a singleintegrated circuit or on a different chip than the processor.

Although the above discussion describes the wedge as being formed ofstrips directly patterned using a reticle, it should be noted that thestrips and their formation are not limited to such an embodiment. Othermaterials and methods may be used to form the series of strips that areflowed to form the wedge. For example, the strips may be formed of amicrolens-forming material and may be formed using an etching process orlithography.

Various applications of the methods of the invention will becomeapparent to those of skill in the art as a result of this disclosure.Although certain advantages and embodiments have been described above,those skilled in the art will recognize that substitutions, additions,deletions, modifications and/or other changes may be made withoutdeparting from the spirit or scope of the invention. Accordingly, theinvention is not limited by the foregoing description but is onlylimited by the scope of the appended claims.

1. A microlens structure comprising: a layer of solid material supportedby a substrate, an upper surface of the layer having a slope withrespect to an upper surface of the substrate; and a microlens supportedby the layer.
 2. A microlens structure according to claim 1, wherein themicrolens is tilted.
 3. A microlens structure according to claim 1,wherein the layer of solid material comprises a photoresist material. 4.A microlens structure according to claim 1, wherein the layer of solidmaterial comprises a microlens-forming material.
 5. A microlensstructure according to claim 1, wherein the microlens is supporteddirectly on the layer of solid material.
 6. A microlens structureaccording to claim 2, wherein the tilt angle between the upper surfaceof the layer and the substrate is less than about 10 degrees.
 7. Amicrolens structure according to claim 1, wherein the layer of solidmaterial is a flowed material.
 8. A microlens structure according toclaim 1, wherein the upper surface of the layer of solid material hasbumps.
 9. A microlens structure according to claim 1, wherein the uppersurface of the layer of solid material is smooth.
 10. A microlens arraycomprising: a plurality of microlenses provided over a substrate; and aplurality of wedges of solid material, each wedge being positionedbetween the substrate and a respective microlens and supporting therespective microlens.
 11. A microlens array according to claim 10,wherein a microlens-supporting surface of the wedge is inclined withrespect to a surface of the substrate by less than about 10 degrees. 12.A microlens array according to claim 10, wherein the wedge comprises aphotoresist material.
 13. A microlens array according to claim 10,wherein the wedge comprises a microlens material.
 14. A microlens arrayaccording to claim 10, wherein the wedge comprises a flowed material.15. A microlens array according to claim 10, wherein there are bumps onthe supporting surface of the wedge.
 16. A microlens array according toclaim 10, wherein the supporting surface of the wedge is smooth.
 17. Amicrolens array according to claim 10, wherein at least two of saidplurality of microlenses are positioned over a common photosensitivedevice for directing incident light to the common photosensitive device.18. A microlens array according to claim 10, wherein each of saidplurality of microlenses are positioned over a respective plurality ofphotosensitive devices for directing incident light to each respectivephotosensitive device.
 19. An imager structure comprising: a pluralityof pixels formed in a substrate; a planar layer formed over saidplurality of pixels; a plurality of wedge structures formed on theplanar layer, each wedge structure being positioned to pass incidentlight to at least one of the plurality of pixels; and a plurality ofmicrolenses, each microlens being respectively supported by at least oneof the plurality of wedge structures.
 20. An imager structure of claim19, wherein each wedge structure is positioned over one of the pluralityof pixels, respectively, to direct incident light to the respectivepixel.
 21. An imager structure of claim 19, wherein at least two wedgestructures are positioned to direct incident light to one of saidplurality of pixels.
 22. An imager structure as in claim 19, whereineach respective wedge structure of the plurality of wedge structuresslopes in the same direction.
 23. An imager structure as in claim 19,wherein the plurality of wedge structures comprises a flowed material.24. An imager structure as in claim 19, wherein at least one of theplurality of wedge structures has a smooth upper surface.
 25. An imagerstructure as in claim 19, wherein at least one of the plurality of wedgestructures has a bumpy upper surface.
 26. An imager structure as inclaim 19, wherein at least one pair of wedge structures slope away fromeach other.
 27. An imager structure as in claim 19, wherein at least onegroup of four wedge structures slope away from a center of the at leastone group of four wedge structures.
 28. An image processing systemcomprising: a processor; an imager structure comprising: a plurality ofpixels formed in a substrate; a planar layer formed over said pluralityof pixels; a plurality of wedge structures formed on the planar layer,each wedge structure being positioned to pass incident light to at leastone of the plurality of pixels; and a plurality of microlenses, eachmicrolens being respectively supported by at least one of the pluralityof wedge structures.
 29. An image processing system of claim 28, whereineach wedge structure is positioned over one of the plurality of pixels,respectively, to direct incident light to the respective pixel.
 30. Animage processing system of claim 28, wherein at least two wedgestructures are positioned to direct incident light to one of saidplurality of pixels.
 31. An image processing system of claim 28, whereineach respective wedge structure of the plurality of wedge structuresslopes in the same direction.
 32. An image processing system of claim28, wherein the plurality of wedge structures comprises a flowedmaterial.
 33. An image processing system of claim 28, wherein at leastone of the plurality of wedge structures has a smooth upper surface. 34.An image processing system of claim 28, wherein at least one of theplurality of wedge structures has a bumpy upper surface.
 35. An imageprocessing system of claim 28, wherein each respective wedge structureof the plurality of wedge structures slopes in the same direction. 36.An image processing system of claim 28, wherein at least one pair ofwedge structures slope away from each other.
 37. An image processingsystem of claim 28, wherein at least one group of four wedge structuresslope away from a center of the group of four wedge structures. 38-46.(canceled)